ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,058, issued on Aug. 4, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.). "Three-dimensional semiconductor package having a ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,059, issued on Aug. 4, was assigned to Aledia (Champagnier, France), Commissariat al'Energie Atomique et aux Energies Alternatives (Paris) an... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,060, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package and method for forming the sa... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,061, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor dies including recesses for facilitating mechan... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,062, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Memory on package (MOP) with reverse CAMM (compression attached m... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,063, issued on Aug. 4, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan). "Display apparatus and electronic device" w... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,064, issued on Aug. 4, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Power distribution for stacked ele... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,065, issued on Aug. 4, was assigned to XILINX INC. (San Jose, Calif.). "Chip package integration with hybrid bonded bridge die" was invented... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,066, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display apparatus" was invented by Juyeon Jeon... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,067, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Gunho C... Read More